Because no heat is applied, components and the PCB substrate are safe from thermal shock, warping, or delamination.
Exposing the connection to gases like sulfur dioxide ( SO2cap S cap O sub 2 ) or hydrogen sulfide ( H2Scap H sub 2 cap S iec 60352-5 pdf
IEC 60352-5 titled covers the mechanical and electrical properties of these connections. The standard applies to: Because no heat is applied, components and the
Whether you are a PCB designer or a manufacturing engineer, having access to the current is essential for meeting industry quality standards. Because no heat is applied
No flux cleaners, lead hazards, or volatile organic compounds (VOCs) are introduced into the factory environment.