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Hot cracking remains a critical solidification defect in specialty alloys, particularly those employed in electronic components subjected to rapid thermal cycling. This paper investigates “Cymcap hot crack” – a failure mode observed in a proprietary copper–manganese–nickel based alloy (Cymcap) used for capacitor end-cap terminations. Through optical microscopy, scanning electron microscopy (SEM), and differential scanning calorimetry (DSC), we identify the primary mechanism as solidification cracking during reflow soldering or high-temperature exposure. The cracking is exacerbated by a wide freezing range, low ductility at temperatures near solidus, and tensile residual stresses. Mitigation strategies including grain refinement, reduced cooling rates, and modified manganese content are evaluated. Results indicate that reducing Mn from 12 wt% to 9 wt% narrows the freezing range by 40°C and eliminates hot cracking in standard reflow profiles. cymcap hot crack